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Proceedings Paper

Specular spectroscopic scatterometry in DUV lithography
Author(s): Xinhui Niu; Nickhil H. Jakatdar; Junwei Bao; Costas J. Spanos; Sanjay K. Yedur
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Paper Abstract

Scatterometry is a one of the few types of metrology that has true in-situ potential for deep submicron CD and profile analysis. To date, commercial prototypes have been used to establish scatterometry based on single wavelength, multiple incident angle inspection. We extend this idea by deploying specular spectroscopic scatterometry (SSS). Conventional scatterometry is designed to measure either many diffraction orders or variable incident/collection angle at a single wavelength. Specular spectroscopic scatterometry is designed to measure the 0th order diffraction responses at a fixed angle of incidence. Specular spectroscopic scatterometry can make direct use of the existing spectroscopic ellipsometry equipment. We show that SSS provides an accurate, inexpensive, and non-destructive CD metrology solution.

Paper Details

Date Published: 14 June 1999
PDF: 10 pages
Proc. SPIE 3677, Metrology, Inspection, and Process Control for Microlithography XIII, (14 June 1999); doi: 10.1117/12.350802
Show Author Affiliations
Xinhui Niu, Timbre Technology, Inc. and Univ. of California/Berkeley (United States)
Nickhil H. Jakatdar, Univ. of California/Berkeley (United States)
Junwei Bao, Univ. of California/Berkeley (United States)
Costas J. Spanos, Univ. of California/Berkeley (United States)
Sanjay K. Yedur, Advanced Micro Devices, Inc. and SEMATECH (United States)


Published in SPIE Proceedings Vol. 3677:
Metrology, Inspection, and Process Control for Microlithography XIII
Bhanwar Singh, Editor(s)

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