
Proceedings Paper
Composite ultrasound transducer arrays for operation above 20 MHzFormat | Member Price | Non-Member Price |
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$17.00 | $21.00 |
Paper Abstract
Methods for fabricating and modeling high frequency 2-2 composites and arrays are presented. The composites are suitable for arrays and small aperture single element devices operating above 20 MHz. Coupling coefficients above 0.65 and lateral mode frequencies near 60 MHz were achieved with this composite. Backing and matching materials were prepared to provide up to 70% bandwidth and coaxial cable was used to impedance match the elements to a 50 ohm source. A TPX lens was fabricated and bonded to the face to provide focusing in the elevation direction. Three prototype 4 element 30 MHz linear arrays were designed and built. The designs were analyzed in a time domain finite element analysis program and excellent agreement between theory and experiment was achieved.
Paper Details
Date Published: 21 June 1999
PDF: 9 pages
Proc. SPIE 3664, Medical Imaging 1999: Ultrasonic Transducer Engineering, (21 June 1999); doi: 10.1117/12.350660
Published in SPIE Proceedings Vol. 3664:
Medical Imaging 1999: Ultrasonic Transducer Engineering
K. Kirk Shung, Editor(s)
PDF: 9 pages
Proc. SPIE 3664, Medical Imaging 1999: Ultrasonic Transducer Engineering, (21 June 1999); doi: 10.1117/12.350660
Show Author Affiliations
Timothy A. Ritter, Pennsylvania State Univ. (United States)
K. Kirk Shung, Pennsylvania State Univ. (United States)
Xuecang Geng, Pennsylvania State Univ. (United States)
K. Kirk Shung, Pennsylvania State Univ. (United States)
Xuecang Geng, Pennsylvania State Univ. (United States)
Patrick D. Lopath, Pennsylvania State Univ. (United States)
Richard L. Tutwiler, Pennsylvania State Univ. (United States)
Thomas R. Shrout, Pennsylvania State Univ. (United States)
Richard L. Tutwiler, Pennsylvania State Univ. (United States)
Thomas R. Shrout, Pennsylvania State Univ. (United States)
Published in SPIE Proceedings Vol. 3664:
Medical Imaging 1999: Ultrasonic Transducer Engineering
K. Kirk Shung, Editor(s)
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