Share Email Print

Proceedings Paper

Develop temperature and process study on a thick film photoresist
Author(s): Octavia P. Lehar; Kathryn H. Jensen
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

In a variety of microlithographic applications the importance of thick film photoresist continues to grow. Thick film photoresists are evolving into materials, which can meet the demand for smaller features while maintaining good exposure latitude, depth of focus, sidewall profiles, and photospeed. It is know that the performance characteristics of photoresists will change with changing process conditions and that the best performance of a photoresist is achieved by optimization of these conditions. One of the more critical steps in the lithographic process is development, which requires a tight process control. In our study we evaluated the effects of developer temperature and developing mode such as spray, spray/puddle, and immersion. The performance of an advanced thick film photoresists was examined regarding to resolution, depth of focus, exposure latitude, profile, photospeed, and scumming. A full lithographic evaluation was carried out. Assessment of the thick film photoresist, which is a commercially available product, was done on a Nikon. This paper includes a discussion, looking at the best compromise of performance based on temperature and develop process.

Paper Details

Date Published: 11 June 1999
PDF: 12 pages
Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); doi: 10.1117/12.350256
Show Author Affiliations
Octavia P. Lehar, Clariant Corp. (United States)
Kathryn H. Jensen, Clariant Corp. (United States)

Published in SPIE Proceedings Vol. 3678:
Advances in Resist Technology and Processing XVI
Will Conley, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?