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Proceedings Paper

Screening of DNQ/novolac resists with e-beam exposure
Author(s): Theodore H. Fedynyshyn; Scott P. Doran; Michele L. Lind; Theodore M. Lyszczarz; William F. DiNatale; Donna Lennon; Charles A. Sauer; Jeff Meute
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Paper Abstract

We have surveyed the commercial resist market with the dual purpose of identifying diazoquinone/novolac based resist that have potential for use as e-beam mask making resists and baselining these resist for comparison against future mask making resist candidates. For completeness, such a survey would require that each resists be compared with an optimized developer and develop process. To accomplish this task in an acceptable time period we have chosen to perform e-beam lithography modeling to quickly identify the resist developer combinations that will lead to superior resists performance. We describe the development and verification of a method to quickly screen commercial i-line resists under e-beam exposure with different developers. This was accomplished by determining modeling parameters for i-line resist from e-beam exposures, modeling the resist performance, and comparing predicted performance versus actual performance. We evaluated whether the technique of combining e-beam resist modeling with lithography can be used to quickly and efficiently screen i-line resists for use in e-beam mask making. This was accomplished by comparing experimentally determined resists sensitivities and profiles with those predicted from ProBeam/3D lithography modeling software.

Paper Details

Date Published: 11 June 1999
PDF: 11 pages
Proc. SPIE 3678, Advances in Resist Technology and Processing XVI, (11 June 1999); doi: 10.1117/12.350180
Show Author Affiliations
Theodore H. Fedynyshyn, MIT Lincoln Lab. (United States)
Scott P. Doran, MIT Lincoln Lab. (United States)
Michele L. Lind, MIT Lincoln Lab. (United States)
Theodore M. Lyszczarz, MIT Lincoln Lab. (United States)
William F. DiNatale, MIT Lincoln Lab. (United States)
Donna Lennon, MIT Lincoln Lab. (United States)
Charles A. Sauer, Etec Systems, Inc. (United States)
Jeff Meute, International SEMATECH (United States)

Published in SPIE Proceedings Vol. 3678:
Advances in Resist Technology and Processing XVI
Will Conley, Editor(s)

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