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Proceedings Paper

Dynamic monitoring of structural health in cable-supported bridges
Author(s): Jan Ming Ko; Yi-Qing Ni; Hung-tin Tommy Chan
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Paper Abstract

A sophisticated instrumentation system, called Wind and Structural Health Monitoring System (WASHMS), is devised by the Hong Kong Highways Department to monitor the structural health and performance of three long-span cable-supported bridges in Hong Kong. This system consists of about 900 sensors including accelerometers. Strain gauges, displacement transducers, level sensing stations, anemometers, temperature sensors and wight-in-motion sensors. The Hong Kong Polytechnic University is commissioned to investigate the feasibility of using measured dynamic characteristics for structural damage detection in these bridges. Explored in this paper are some key issues related to developing a viable vibration-based damage assessment strategy for these bridges: (a) Evaluation of possible damage likely to occur in the three bridges - the detectibility of damage to structural components by using global or local dynamic characteristics is discussed; (b) Concept and rules of damage detection oriented modeling for large-scale structures - a super-element formulation for complicated two-tier bridge deck is developed within this framework; (c) System identification methodology for heavily redundant structures - a neural network based hierarchical identification strategy is pose for successively detecting the occurrence, type, location and extent of the damage.

Paper Details

Date Published: 18 May 1999
PDF: 12 pages
Proc. SPIE 3671, Smart Structures and Materials 1999: Smart Systems for Bridges, Structures, and Highways, (18 May 1999); doi: 10.1117/12.348666
Show Author Affiliations
Jan Ming Ko, Hong Kong Polytechnic Univ. (Hong Kong)
Yi-Qing Ni, Hong Kong Polytechnic Univ. (Hong Kong)
Hung-tin Tommy Chan, Hong Kong Polytechnic Univ. (Hong Kong)

Published in SPIE Proceedings Vol. 3671:
Smart Structures and Materials 1999: Smart Systems for Bridges, Structures, and Highways
S.-C. Liu, Editor(s)

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