Share Email Print

Proceedings Paper

Main characteristics of a miniaturized multipurpose infrared spectrometer
Author(s): Kimmo Keraenen; Martti Blomberg; Outi Rusanen; Pentti Karioja; Jussi Tenhunen; Harri K. Kopola; Ari Lehto
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

This paper describes the main characteristics of a miniaturized multipurpose IR spectrometer. The miniaturized spectrometer comprise of three silicon micromachined devices: an electrically modulated thermal IR emitter, and electrically tunable Fabry-Perot interferometer and a photodetector. The IR emitter and the detector are monolithically integrated into a silicon substrate. In addition, the silicon substrate carries an integrated circuit die-bonded and wire-bonded on the silicon substrate. The whole spectrometer assembly is packaged in a DIL package having holes for the incoming and outgoing radiation. The dimensions of the package are 12 mm X 23 mm X 5 mm. This concept enables the realization of a miniaturized spectrometer for high-volume and low-cost products. In the miniaturization, the critical optical characteristic is the throughput of a system. In addition, the S/N-ratio and crosstalk of the module are the main electrical characteristics to be considered in the miniaturization. In this paper, the performance of the spectrometer module is presented via measurements including the radiometric analysis, S/N-ratio analysis and crosstalk analysis.

Paper Details

Date Published: 30 April 1999
PDF: 8 pages
Proc. SPIE 3631, Optoelectronic Integrated Circuits and Packaging III, (30 April 1999); doi: 10.1117/12.348309
Show Author Affiliations
Kimmo Keraenen, VTT Electronics (Finland)
Martti Blomberg, VTT Electronics (Finland)
Outi Rusanen, VTT Electronics (Finland)
Pentti Karioja, VTT Electronics/Infotech Oulu (Finland)
Jussi Tenhunen, VTT Electronics (Finland)
Harri K. Kopola, VTT Electronics (Finland)
Ari Lehto, VTT Electronics (Finland)

Published in SPIE Proceedings Vol. 3631:
Optoelectronic Integrated Circuits and Packaging III
Michael R. Feldman; Michael R. Feldman; James G. Grote; Mary K. Hibbs-Brenner, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?