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Proceedings Paper

Combined measurement of shape and deformation of microcomponents by holographic interferometry and multiple-wavelength contouring
Author(s): Soenke Seebacher; Wolfgang Osten; Chr. Wagner
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Paper Abstract

Progresses in microsystem technology promise a lot of new applications in industry and research. However, the increased complexity of the microsystems demand sensitive and robust measurement techniques. Full-field and non invasive methods are desirable to get access to material properties and parameters. This contribution describes a simple and fast technology for the analysis of shape and deformation of small objects by optical inspection. These quantities together with a defined loading of the components are the basis for the derivation of a variety of interesting material characteristics. The well known holographic interferometry and multiple wavelength contouring are precise enough to fulfill the requests for precision and resolution in microsystem technology even with structures of complex shape. Digital holography as the underlying holographic recording mechanism is extremely suitable for small objects and leads to simple and compact setups in which the objects' shape as well as their deformation behavior can be inspected. Several experiments are described and show the great potential of these fast and robust measurement techniques.

Paper Details

Date Published: 7 May 1999
PDF: 12 pages
Proc. SPIE 3740, Optical Engineering for Sensing and Nanotechnology (ICOSN '99), (7 May 1999); doi: 10.1117/12.347730
Show Author Affiliations
Soenke Seebacher, Bremen Institute for Applied Beam Technology (Germany)
Wolfgang Osten, Bremen Institute for Applied Beam Technology (Germany)
Chr. Wagner, Bremen Institute for Applied Beam Technology (Germany)

Published in SPIE Proceedings Vol. 3740:
Optical Engineering for Sensing and Nanotechnology (ICOSN '99)
Ichirou Yamaguchi, Editor(s)

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