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Proceedings Paper

Ceramic-metal composites as a solution for high-performance semiconductor laser packaging
Author(s): Jean-Marc Verdiell
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Paper Abstract

Packaging is one of the most critical operation in optoelectronics manufacturing. Optoelectronic packages for semiconductor laser diodes must provide submicron alignment between optical elements, high-speed electrical connections, excellent heat dissipation, and high reliability. We propose the use of composite substrate materials that simplify the design of optoelectronic packages, improve thermal and mechanical performance, and are suitable for high- reliability applications.

Paper Details

Date Published: 14 April 1999
PDF: 12 pages
Proc. SPIE 3626, Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV, (14 April 1999); doi: 10.1117/12.345428
Show Author Affiliations
Jean-Marc Verdiell, LightLogic, Inc. (United States)

Published in SPIE Proceedings Vol. 3626:
Testing, Packaging, Reliability, and Applications of Semiconductor Lasers IV
Mahmoud Fallahi; S. C. Wang; Mahmoud Fallahi; Kurt J. Linden; S. C. Wang, Editor(s)

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