Share Email Print

Proceedings Paper

Characterization of active thermographic system performance
Author(s): Steven M. Shepard; Tasdiq Ahmed
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

The decision to use Thermographic Nondestructive Testing (TNDT) for a particular application is frequently made on an empirical basis using flat bottom hole test samples. In many cases, results are interpreted using subjective, non- quantitative criteria that cannot be generalized to apply to a broader range of applications. Although sensitivity is generally considered an important indicator of TNDT system performance, subsurface spatial resolution is rarely discussed. We present a methodology for TNDT system performance characterization that is loosely modeled on the Modulation Transfer Function (MTF) used in visual imaging. Once a TNDT system has been characterized using this approach, system performance for other applications can be accurately predicted. Examples including a steel resolution target and flat bottom holes in a CMC panel are discussed.

Paper Details

Date Published: 19 March 1999
PDF: 5 pages
Proc. SPIE 3700, Thermosense XXI, (19 March 1999); doi: 10.1117/12.342306
Show Author Affiliations
Steven M. Shepard, Thermal Wave Imaging, Inc. (United States)
Tasdiq Ahmed, Thermal Wave Imaging, Inc. (United States)

Published in SPIE Proceedings Vol. 3700:
Thermosense XXI
Dennis H. LeMieux; John R. Snell Jr., Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?