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Proceedings Paper

Thermal inspection of solder quality of electronic components
Author(s): Jussi Varis; Reijo K. Lehtiniemi; Reijo Vuohelainen
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Paper Abstract

Solder quality of two ball grid array electronic components were studied by using a photothermal inspection technique. In order to introduce artificial defects into the components, columns of soldering joint balls were removed between the electronic component and the printed circuit board. From one of the components, the copper heat slug was also removed to enhance the possibilities for detecting the defects. The components were heated with laser light, and their surface temperatures were monitored with an infrared camera. After heating the component for 1.5 seconds, the defects were resolved, if the plastic covering was removed. In the case of the second component with intact plastic covering, the defects under the component were not resolved. The defects were not visible through the printed circuit board either.

Paper Details

Date Published: 19 March 1999
PDF: 6 pages
Proc. SPIE 3700, Thermosense XXI, (19 March 1999); doi: 10.1117/12.342279
Show Author Affiliations
Jussi Varis, Univ. of Helsinki (Finland)
Reijo K. Lehtiniemi, Nokia Research Ctr. (Finland)
Reijo Vuohelainen, Univ. of Helsinki (Finland)

Published in SPIE Proceedings Vol. 3700:
Thermosense XXI
Dennis H. LeMieux; John R. Snell Jr., Editor(s)

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