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Proceedings Paper

Backside contacts for sensor structure packaging
Author(s): Barbara Janyszek; Ryszard Jachowicz; Dorota Pijanowska; Jerzy Jazwinski
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Paper Abstract

The construction of both the backside contacts and the package for replaceable sensor structure bonding has been described in the paper. Some aspects of technological process for backside contact performance are discussed in the report too. The measurement results from the structure test proved small and stable contact resistance when sensor structures have been changed in the package more than 100 times. A new method of changeable package has been shown.

Paper Details

Date Published: 10 March 1999
PDF: 5 pages
Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341280
Show Author Affiliations
Barbara Janyszek, Industrial Institute of Automation and Measurements (Poland)
Ryszard Jachowicz, Institute of Electronics Systems (Poland)
Dorota Pijanowska, Institute of Biocybernetics and Biomedical Engineering (Poland)
Jerzy Jazwinski, Institute of Electron Technology (Poland)

Published in SPIE Proceedings Vol. 3680:
Design, Test, and Microfabrication of MEMS and MOEMS
Bernard Courtois; Wolfgang Ehrfeld; Selden B. Crary; Wolfgang Ehrfeld; Hiroyuki Fujita; Jean Michel Karam; Karen W. Markus, Editor(s)

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