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Proceedings Paper

Characterization of on-chip coils for rf microsystems
Author(s): Marcus Weser; Josef Binder; Sven Rehfuss; Rainer Laur
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Paper Abstract

For the application of wireless-operated microsystems, on- chip coils are manufactured by 3D UV depth lithography and electroplating. The effects of varying the following parameters were investigated: substrate material, insulation thickness, coil material, coil structure height, coil design and the effect of using an intermediate NiFe layer. The characterization is done with the help of the measured real and imaginary part of the on-chip in a continuous frequency range of 75 kHz to 30 MHz.

Paper Details

Date Published: 10 March 1999
PDF: 8 pages
Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341263
Show Author Affiliations
Marcus Weser, Univ. of Bremen (Germany)
Josef Binder, Univ. of Bremen (Germany)
Sven Rehfuss, Univ. of Bremen (Germany)
Rainer Laur, Univ. of Bremen (Germany)

Published in SPIE Proceedings Vol. 3680:
Design, Test, and Microfabrication of MEMS and MOEMS
Bernard Courtois; Wolfgang Ehrfeld; Selden B. Crary; Wolfgang Ehrfeld; Hiroyuki Fujita; Jean Michel Karam; Karen W. Markus, Editor(s)

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