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Proceedings Paper

Integrated multidisciplinary CAD/CAE environment for micro-electro-mechanical systems (MEMS)
Author(s): Andrzej J. Przekwas
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Paper Abstract

Computational design of MEMS involves several strongly coupled physical disciplines, including fluid mechanics, heat transfer, stress/deformation dynamics, electronics, electro/magneto statics, calorics, biochemistry and others. CFDRC is developing a new generation multi-disciplinary CAD systems for MEMS using high-fidelity field solvers on unstructured, solution-adaptive grids for a full range of disciplines. The software system, ACE + MEMS, includes all essential CAD tools; geometry/grid generation for multi- discipline, multi-equation solvers, GUI, tightly coupled configurable 3D field solvers for FVM, FEM and BEM and a 3D visualization/animation tool. The flow/heat transfer/calorics/chemistry equations are solved with unstructured adaptive FVM solver, stress/deformation are computed with a FEM STRESS solver and a FAST BEM solver is used to solve linear heat transfer, electro/magnetostatics and elastostatics equations on adaptive polygonal surface grids. Tight multidisciplinary coupling and automatic interoperability between the tools was achieved by designing a comprehensive database structure and APIs for complete model definition. The virtual model definition is implemented in data transfer facility, a publicly available tool described in this paper. The paper presents overall description of the software architecture and MEMS design flow in ACE + MEMS. It describes current status, ongoing effort and future plans for the software. The paper also discusses new concepts of mixed-level and mixed- dimensionality capability in which 1D microfluidic networks are simulated concurrently with 3D high-fidelity models of discrete components.

Paper Details

Date Published: 10 March 1999
PDF: 8 pages
Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341230
Show Author Affiliations
Andrzej J. Przekwas, CFD Research Corp. (United States)

Published in SPIE Proceedings Vol. 3680:
Design, Test, and Microfabrication of MEMS and MOEMS
Bernard Courtois; Wolfgang Ehrfeld; Selden B. Crary; Wolfgang Ehrfeld; Hiroyuki Fujita; Jean Michel Karam; Karen W. Markus, Editor(s)

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