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Proceedings Paper

MEMS for space applications
Author(s): Linda M. Miller
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Paper Abstract

Phenomenal advances in MicroElectroMechanical Systems (MEMS) performance has made this technology attractive for the development of micro- and nano-spacecraft. However, much work remains to be done. The space environment is harsh: extreme heat and cold, thermal cycling, radiation effects, and corrosive environments put conventional device designs at risk. Reliably, packaging and flight qualification methodologies need to be developed for MEMS to produce robust devices for a successful future in space micromissions. These issues are discussed in this paper, along with examples of micromissions, MEMS devices in development for space applications, and the ultimate in device integration: a system-on-a-chip.

Paper Details

Date Published: 10 March 1999
PDF: 10 pages
Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341193
Show Author Affiliations
Linda M. Miller, Jet Propulsion Lab. (United States)

Published in SPIE Proceedings Vol. 3680:
Design, Test, and Microfabrication of MEMS and MOEMS
Bernard Courtois; Wolfgang Ehrfeld; Selden B. Crary; Wolfgang Ehrfeld; Hiroyuki Fujita; Jean Michel Karam; Karen W. Markus, Editor(s)

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