This paper describes the fabrication of a new type of metal stencil mask. By using electrodeposited (ED) photoresist in an electrophoretic bath, conformal layer is deposited on both sides of a copper foil, making thus possible double side photolithography. After the exposure through two well aligned mask, containing the structure, and the developing of the photoresist, the copper foil is simultaneous selective electroless nickel deposited on both sides, allowing the stress in the sandwich structure nickel films to balance each other. Transmission holes are etched entirely through the copper membrane resulting in an inherent stress compensated metal stencil mask. The attainable 5 micrometers resolution and high reliability offered by stress compensation of this kind of metal stencil, open very exciting possibilities for low costs selective deposition of metals and insulators in microelectronics, micromechanics and optoelectronics.

Date Published: 10 March 1999
PDF: 8 pages
Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341177

Published in SPIE Proceedings Vol. 3680:
Design, Test, and Microfabrication of MEMS and MOEMS
Bernard Courtois; Wolfgang Ehrfeld; Selden B. Crary; Wolfgang Ehrfeld; Hiroyuki Fujita; Jean Michel Karam; Karen W. Markus, Editor(s)