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Proceedings Paper

Correct-by-construction approach to MEMS design and analysis
Author(s): Barry Dyne; David A. Bernstein
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Paper Abstract

The need for general modeling and analysis tools for MEMS devices has been well established, and several software packages designed to address these needs have appeared in the last five years. While being powerful and comprehensive, existing tools often require specialized knowledge of the methods involved in the analysis, and lack integration into a complete design environment. This paper describes a new MEMS design and analysis tool that uses a correct-by- construction approach in a tightly integrated environment of layout, 3D modeling, analysis, and system design. The MEMS design tool suite is integrated into an existing integrated circuit design package. Our goal is to automate as many steps of the process as possible, thus lowering the barrier to MEMS design.

Paper Details

Date Published: 10 March 1999
PDF: 8 pages
Proc. SPIE 3680, Design, Test, and Microfabrication of MEMS and MOEMS, (10 March 1999); doi: 10.1117/12.341174
Show Author Affiliations
Barry Dyne, Tanner Research, Inc. (United States)
David A. Bernstein, Tanner Research, Inc. (United States)

Published in SPIE Proceedings Vol. 3680:
Design, Test, and Microfabrication of MEMS and MOEMS
Bernard Courtois; Wolfgang Ehrfeld; Selden B. Crary; Wolfgang Ehrfeld; Hiroyuki Fujita; Jean Michel Karam; Karen W. Markus, Editor(s)

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