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In the year 2525, if x ray is still alive, if lithography can survive, they may find...
Author(s): John L. Nistler; Mark Michael; Fred N. Hause; Richard D. Edwards
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Paper Abstract

Data and discussions will be presented on the NTRM, National Technology Roadmap, for reticles based on a Process Integration perception. Specifically two layers are considered for this paper, the gate layer which is primarily a chrome geometry mask with a lot of open glass and a local interconnect layer which is primarily a chrome plate using clear geometries. Information from other sources is used where appropriate and actual in-house data is used to illustrate specific points. Realizing that demands from different customers for specific types of features tend to drive specific mask makers and their decisions on equipment purchases and processes. We attempt to help predict where Integration approaches have either caused a lag in technology pushes or have actually speeded up certain requirements. Discussions of integration requirements, which tend to push maskmakers, will be presented. Along with typical design approaches in OPC and PSM which either will push technology or actually slow down the trend towards smaller geometries. In addition, data will be presented showing how specific stepper characteristics may actually drive the customer's criteria, thus changing the requirements from customer to customer.

Paper Details

Date Published: 18 December 1998
PDF: 13 pages
Proc. SPIE 3546, 18th Annual BACUS Symposium on Photomask Technology and Management, (18 December 1998); doi: 10.1117/12.332840
Show Author Affiliations
John L. Nistler, Advanced Micro Devices, Inc. (United States)
Mark Michael, Advanced Micro Devices, Inc. (United States)
Fred N. Hause, Advanced Micro Devices, Inc. (United States)
Richard D. Edwards, Advanced Micro Devices, Inc. (United States)

Published in SPIE Proceedings Vol. 3546:
18th Annual BACUS Symposium on Photomask Technology and Management
Brian J. Grenon; Frank E. Abboud, Editor(s)

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