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Proceedings Paper

SIA Roadmap: impact on the lithography foodchain (Presentation Only)
Author(s): Klaus-Dieter Rinnen
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Paper Abstract

The evolutionary path of optical lithography is nearing its end . . . or is it? This presentation looks at the ramifications of the 1997 National Technology Road Map on the Photolithography segment, with special focus on the Photomask market. The SIA Roadmap points to a host of challenges that the industry is facing in years to come. These challenges range from an aggressive continuation of device scaling and the associated longer-range question about 'Life after optical Lithography,' to larger wafer sizes with larger sized masks to reduced time to market requirements. While the presentation touches only lightly on the technical aspects of these issues, it will focus in detail on the question: what does it all mean to the business?

Paper Details

Date Published: 18 December 1998
PDF: 8 pages
Proc. SPIE 3546, 18th Annual BACUS Symposium on Photomask Technology and Management, (18 December 1998); doi: 10.1117/12.332836
Show Author Affiliations
Klaus-Dieter Rinnen, Dataquest (United States)

Published in SPIE Proceedings Vol. 3546:
18th Annual BACUS Symposium on Photomask Technology and Management
Brian J. Grenon; Frank E. Abboud, Editor(s)

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