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Proceedings Paper

Toward 150-nm defect detection capability
Author(s): Yair Eran; Gad Greenberg; Michael M. Har-Zvi
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Paper Abstract

With the advance of photolithography technology into the super-resolution regime, reticle features are becoming denser and their dimensions are shrinking. This leads to much stricter design rules, which include a decrease in the dimensions of the critical defects needed to be detected. Orbot-Applied's new Improved Image Acquisition module has been developed as a means of meeting the rising demand in defect detection capability and integrated into RT-8000ES Die-to-Database reticle inspection system. The main purpose of this evaluation was to test the system's performance under difficult production conditions in its highest defect detection sensitivities.

Paper Details

Date Published: 1 September 1998
PDF: 8 pages
Proc. SPIE 3412, Photomask and X-Ray Mask Technology V, (1 September 1998); doi: 10.1117/12.328837
Show Author Affiliations
Yair Eran, Orbot-Applied Industries (Israel)
Gad Greenberg, Orbot-Applied Industries (Israel)
Michael M. Har-Zvi, Orbot-Applied Industries (Israel)

Published in SPIE Proceedings Vol. 3412:
Photomask and X-Ray Mask Technology V
Naoaki Aizaki, Editor(s)

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