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Proceedings Paper

Infrared imager employing a 160x120 pixel uncooled bolometer array
Author(s): Paul W. Kruse; Randy Dodson; Shane Anderson; Lee Kantor; Mike Knipfer; Timothy J. McManus; R. Andrew Wood; Tom Rezachek
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Paper Abstract

We have developed an uncooled thermal imager having 160 X 120, 50 micrometer X 50 micrometer pixels which operates at 30 Hz frame rate. It employs a complementary metal oxide silicon (CMOS) redout integrated circuit (ROIC) beneath a vanadium oxide (VOx) silicon microstructure bolometric array. Imagery output is in RS-170 format. An RS-232 port can be employed to command operation from a remote location. Weight of the 'engine,' consisting of the focal plane array in is package plus three circuit boards, each 3 X 3 inches, is 8 oz. Input power is 2.5 Watts. Also included on the boards is a circuit which avoids the need for a temperature stabilizer in the array package. Operating in the 8 - 14 micrometer spectral interval, the imager has a noise equivalent temperature difference (NETD) with an f/0.8 lens against 295 K targets of less than or equal to 0.1C. The dynamic range of 66 dB will accommodate very hot targets without saturation of an image which also contains 290 K targets.

Paper Details

Date Published: 26 October 1998
PDF: 6 pages
Proc. SPIE 3436, Infrared Technology and Applications XXIV, (26 October 1998); doi: 10.1117/12.328056
Show Author Affiliations
Paul W. Kruse, Infrared Solutions, Inc. (United States)
Randy Dodson, Infrared Solutions, Inc. (United States)
Shane Anderson, Infrared Solutions, Inc. (United States)
Lee Kantor, Infrared Solutions, Inc. (United States)
Mike Knipfer, Infrared Solutions, Inc. (United States)
Timothy J. McManus, Infrared Solutions, Inc. (United States)
R. Andrew Wood, Honeywell Technology Ctr. (United States)
Tom Rezachek, Honeywell Technology Ctr. (United States)

Published in SPIE Proceedings Vol. 3436:
Infrared Technology and Applications XXIV
Bjorn F. Andresen; Marija Strojnik, Editor(s)

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