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Proceedings Paper

Machine vision algorithms for semiconductor wafer inspection: a project with Inspex
Author(s): Chi Hau Chen; Tzu-Hung Cheng; Wo-Tak Wu; Shawn Driscoll
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Paper Abstract

With increased demand for reliable and automated semiconductor wafer inspection, machine vision techniques are much needed for defect extraction and identification and pre- and post-processing operations. The wavelet-based approach is emphasized in this paper for its capability to meet different needs in wafer inspection. The algorithms involved are illustrated by using a number of wafer inspection images.

Paper Details

Date Published: 6 October 1998
PDF: 8 pages
Proc. SPIE 3521, Machine Vision Systems for Inspection and Metrology VII, (6 October 1998); doi: 10.1117/12.326963
Show Author Affiliations
Chi Hau Chen, Univ. of Massachusetts/Dartmouth (United States)
Tzu-Hung Cheng, Univ. of Massachusetts/Dartmouth (United States)
Wo-Tak Wu, Inspex, Inc. (United States)
Shawn Driscoll, Inspex, Inc. (United States)

Published in SPIE Proceedings Vol. 3521:
Machine Vision Systems for Inspection and Metrology VII
Bruce G. Batchelor; John W. V. Miller; Susan Snell Solomon, Editor(s)

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