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Proceedings Paper

Influence of the material properties on the thermal behavior of a package
Author(s): Kirsten Weide; Christian Keck; Xiaoying Yu
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Paper Abstract

The trend in microelectronic is increasing power density of IC devices in conjunction with decreasing package size. Out of this a consideration of the thermal behavior of the package and its vicinity, caused by a strong influence of the operating temperature on the component lifetime and its reliability is needed. A better outlet of the dissipated power is necessary. The temperature distribution in a package is influenced by the heat conduction in the package, depending on the different heat conductivities of the used materials. Also convection must be taken into account. In this paper a finite element model of a SOP8 plastic mounted on a printed circuit board was investigated. The influence of the material properties of the package epoxy, the adhesive, the chip carrier and the material of the printed circuit board on the temperature distribution was investigated. Also the influence of the area covered by the adhesive on the temperature behavior and the mechanical stress was investigated.

Paper Details

Date Published: 28 August 1998
PDF: 10 pages
Proc. SPIE 3510, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV, (28 August 1998); doi: 10.1117/12.324388
Show Author Affiliations
Kirsten Weide, Univ. Hannover (Germany)
Christian Keck, Univ. Hannover (Germany)
Xiaoying Yu, Univ. Hannover (Germany)

Published in SPIE Proceedings Vol. 3510:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis IV
Sharad Prasad; Hans-Dieter Hartmann; Tohru Tsujide, Editor(s)

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