Share Email Print

Proceedings Paper

Developments in focused ion beam metrology
Author(s): Jesse A. Salen; Gregory J. Athas; Drew Barnes; Neil J. Bassom; Don E. Yansen
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

We present the ability of a focused ion beam system (FIB) to perform as an effective metrology tool. This feature is a benefit in areas where FIB technology is or can be used, or where pre-measurement cross-sectioning is required, such as the case in thin film head trimming, integrated circuit inspection, and micro-electromechanical device (MEMS) development. The FIB is a proven tool for taking high- resolution images, performing mills and depositions, and cross-sectioning samples. We demonstrate the FIB's ability to perform these tasks in a repeatable manner and take accurate measurements independently of the operator. First, we find a quantitative method for analyzing the image quality in order to remove any operator discrepancy. We show that this task can be achieved by analyzing the FIB's Modulation Transfer Function (MTF). The MTF is a proven method for measuring the quality of light optics, but has never been used as a standard in FIB imaging because sub- 100m pitch resolution targets can not easily be fabricated; however, we demonstrate a new method for obtaining the MTF. By correlating changes in FIB parameters to changes in the MTF, we have a FIB image standard, as well as an image calibration tool that is transparent to the operator. Second, we describe how current FIB software can use an automated 'measure tool' to take accurate measurements independently of the operator. We show that when using both these methods, the FIB is a repeatable metrology tool for a variety of applications.

Paper Details

Date Published: 3 September 1998
PDF: 9 pages
Proc. SPIE 3507, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV, (3 September 1998); doi: 10.1117/12.324349
Show Author Affiliations
Jesse A. Salen, Micrion Corp. (United States)
Gregory J. Athas, Micrion Corp. (United States)
Drew Barnes, Micrion Corp. (United States)
Neil J. Bassom, Micrion Corp. (United States)
Don E. Yansen, Micrion Corp. (United States)

Published in SPIE Proceedings Vol. 3507:
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV
Anthony J. Toprac; Kim Dang, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?