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Proceedings Paper

Combining the best of bulk and surface micromachining using Si (111) substrates
Author(s): James G. Fleming
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Paper Abstract

This process combines the best features of bulk and surface micromachining. It enables the production of stress free, thick, virtually arbitrarily shaped structures with well defined, thick or thin sacrificial layers, high sacrificial layer selectivity and large undercuts using IC compatible, processes. The basis of this approach is the use of readily available {111} oriented substrates, anisotropic Si trench etching, SiN masking and KOH etching.

Paper Details

Date Published: 31 August 1998
PDF: 7 pages
Proc. SPIE 3511, Micromachining and Microfabrication Process Technology IV, (31 August 1998); doi: 10.1117/12.324294
Show Author Affiliations
James G. Fleming, Sandia National Labs. (United States)

Published in SPIE Proceedings Vol. 3511:
Micromachining and Microfabrication Process Technology IV
James H. Smith, Editor(s)

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