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Proceedings Paper

Applications of Forcefill aluminum for contact and via metallization
Author(s): Juergen Foerster; Werner K. Robl; Norbert Rausch; Manfred Frank; D. Butler; Paul Rich; J. Marktanner
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Paper Abstract

The application of Forcefill®, the high pressure holefill technique for 0.5 micrometer device production is discussed in this paper. For process optimization holefill characteristics are presented as function of Forcefill® pressure, temperature and process time. Holefill analysis is performed by SEM plan view and cross section. SEM results are correlated to resistance measurements. The productivity of the Forcefill® process is discussed also. Data are presented showing the very low particle additions achievable with this technique.

Paper Details

Date Published: 4 September 1998
PDF: 8 pages
Proc. SPIE 3508, Multilevel Interconnect Technology II, (4 September 1998); doi: 10.1117/12.324040
Show Author Affiliations
Juergen Foerster, Siemens AG (Germany)
Werner K. Robl, Siemens AG (Germany)
Norbert Rausch, Siemens AG (Germany)
Manfred Frank, Siemens AG (Germany)
D. Butler, Trikon Technologies, Ltd. (United Kingdom)
Paul Rich, Trikon Technologies, Ltd. (United Kingdom)
J. Marktanner, Trikon Technologies GmbH (Germany)

Published in SPIE Proceedings Vol. 3508:
Multilevel Interconnect Technology II
Mart Graef; Divyesh N. Patel, Editor(s)

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