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Proceedings Paper

Acoustic wave chemical microsensors in GaAs
Author(s): Stephen A. Casalnuovo; Edwin J. Heller; Vincent M. Hietala; Albert G. Baca; Richard J. Kottenstette; Susan L. Hietala; John L. Reno; Gregory C. Frye-Mason
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Paper Abstract

High sensitivity acoustic wave chemical microsensors are being developed on GaAs substrates. These devices take advantage of the piezoelectric properties of GaAs as well as its mature microelectronics fabrication technology and nascent micromachining technology. The design, fabrication, and response of GaAs SAW chemical microsensors are reported. Functional integrated GaAs SAW oscillators, suitable for chemical sensing, have been produced. The integrated oscillator requires 20 mA at 3 VDC, operates at frequencies up to 500 MHz, and occupies approximately 2 mm2. Discrete GaAs sensor components, including IC amplifiers, SAW delay lines, and IC phase comparators have been fabricated and tested. A temperature compensation scheme has been developed that overcomes the large temperature dependence of GaAs acoustic wave devices. Packaging issues related to bonding miniature flow channels directly to the GaAs substrates have been resolved. Micromachining techniques for fabricating FPW and TSM microsensors on thin GaAs membranes are presented and GaAs FPW delay line performance is described. These devices have potentially higher sensitivity than existing GaAs and quartz SAW sensors.

Paper Details

Date Published: 8 September 1998
PDF: 8 pages
Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); doi: 10.1117/12.323923
Show Author Affiliations
Stephen A. Casalnuovo, Sandia National Labs. (United States)
Edwin J. Heller, Sandia National Labs. (United States)
Vincent M. Hietala, Sandia National Labs. (United States)
Albert G. Baca, Sandia National Labs. (United States)
Richard J. Kottenstette, Sandia National Labs. (United States)
Susan L. Hietala, Sandia National Labs. (United States)
John L. Reno, Sandia National Labs. (United States)
Gregory C. Frye-Mason, Sandia National Labs. (United States)

Published in SPIE Proceedings Vol. 3514:
Micromachined Devices and Components IV
Patrick J. French; Kevin H. Chau, Editor(s)

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