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Proceedings Paper

Acoustic wavelet analysis using micro-electro-mechanical sensors
Author(s): Markus Mueller; Hiroshi Toshiyoshi; Hiroyuki Fujita
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Paper Abstract

We have developed several types of mechanical and electro- mechanical acoustic sensors using SOI (silicon on insulator) micromachining technique. This paper describes the design, the fabrication and the characterization of three such acoustic sensors. The goal of our research is to integrate a preprocessor for a voice/speech recognition system on a silicon chip, and to create an implantable hearing aid device.

Paper Details

Date Published: 8 September 1998
PDF: 9 pages
Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); doi: 10.1117/12.323905
Show Author Affiliations
Markus Mueller, Swiss Federal Institute of Technology (Switzerland)
Hiroshi Toshiyoshi, Univ. of Tokyo (Japan)
Hiroyuki Fujita, Univ. of Tokyo (Japan)

Published in SPIE Proceedings Vol. 3514:
Micromachined Devices and Components IV
Patrick J. French; Kevin H. Chau, Editor(s)

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