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Proceedings Paper

Integrated mixed-technology design environment to support micro-electro-mechanical systems development
Author(s): Jean Michel Karam; Bernard Courtois; Ariel D. Cao; K. Hofmann
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Paper Abstract

A major hurdle to the development of Micro Electro Mechanical Systems (MEMS) resides on the lack of communication link between the mechanical (or physical) world and the electronic world. Within a development phase, each team handles the tools traditionally used in its disciplines without any common interface. When using field solvers, e.g. finite element methods, MEMS engineers identify material properties and boundary conditions, and built a mesh, so the tool can run a 3D finite elements solution. The tool can predict the amount of stress and strain in the structures, the movement or any other interesting characteristics, but none of this information can be automatically transferred to an IC design tool. In addition, the straightforward advances within the latest developments of the mainstream semiconductor industry is the use of already available intellectual property (IP) in the development of systems optically matched to the end product specifications. These prospects call for a new generation of design tools that combines aspects of EDA and mechanical/thermal/fluidic CAD. The new product suite presented in this paper offers an integrated solution allowing a continuous design flow from front-end to back- end. The end objective is to bring to the system level designer, a complete design flow, down to the chip level, anchored on design re-use and reliable system-level simulation, thus leveraging standard IP products for the realization of sophisticated miniature systems, at low cost.

Paper Details

Date Published: 8 September 1998
PDF: 9 pages
Proc. SPIE 3514, Micromachined Devices and Components IV, (8 September 1998); doi: 10.1117/12.323899
Show Author Affiliations
Jean Michel Karam, MEMSCAP S.A. (France)
Bernard Courtois, TIMA Lab. (France)
Ariel D. Cao, Mentor Graphics Corp. (United States)
K. Hofmann, Darmstadt Univ. of Technology (Germany)

Published in SPIE Proceedings Vol. 3514:
Micromachined Devices and Components IV
Patrick J. French; Kevin H. Chau, Editor(s)

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