
Proceedings Paper
Calibration of the device simulation program suitable for low-temperature applicationFormat | Member Price | Non-Member Price |
---|---|---|
$17.00 | $21.00 |
Paper Abstract
Temperature dependent mobility in the device simulation program has been used to check whether they are adequate to simulate device characteristics under low temperature operation. The study here shows that although the mobility models in the simulation program can be used to simulate room temperature device characteristics, care should be taken for the low temperature simulation. By substituting the extracted mobility table or the suitable mobility model into the simulation program, better simulation results can be obtained. To this point, we believe that there is still a need to develop a better and more concentrated and temperature dependent mobility model.
Paper Details
Date Published: 14 September 1998
PDF: 9 pages
Proc. SPIE 3360, Infrared Readout Electronics IV, (14 September 1998); doi: 10.1117/12.321758
Published in SPIE Proceedings Vol. 3360:
Infrared Readout Electronics IV
Bedabrata Pain; Terrence S. Lomheim, Editor(s)
PDF: 9 pages
Proc. SPIE 3360, Infrared Readout Electronics IV, (14 September 1998); doi: 10.1117/12.321758
Show Author Affiliations
Wei-Lee Lu, Chinese Naval Academy (Taiwan)
Jah-Hwai Ho, Department of the Army (Taiwan)
Kun-Fu Tseng, Chung Cheng Institute of Technology (Taiwan)
Jah-Hwai Ho, Department of the Army (Taiwan)
Kun-Fu Tseng, Chung Cheng Institute of Technology (Taiwan)
Ting-Hwan Chang, Chung Cheng Institute of Technology (Taiwan)
Jenn-Gee Lwo, Chinese Naval Academy (Taiwan)
Luke Su Lu, Chung Cheng Institute of Technology (Taiwan)
Jenn-Gee Lwo, Chinese Naval Academy (Taiwan)
Luke Su Lu, Chung Cheng Institute of Technology (Taiwan)
Published in SPIE Proceedings Vol. 3360:
Infrared Readout Electronics IV
Bedabrata Pain; Terrence S. Lomheim, Editor(s)
© SPIE. Terms of Use
