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Proceedings Paper

3D microfabrication technology
Author(s): Esheng Tang; Yi FuTing; Yangchao Tian; Jingqiu Liang; Dingchang Xian
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Paper Abstract

In the late of this century the great success of VSIC impacts into almost every fields of our social. Following this idea people starts to integrate microsensor microprocessor and microactuators into a small space to forming a Micro Electro and Mechanical System. Such small robot parts are applied to including satellites, computer communication, medical, chemical, biological and environment and so on research fields. The development of MEMS would strongly influence industrial revolution in the next century. LIGA technology including X-ray deep etching lithography; electroplating and plastic molding developed by Karlsruhe Nuclear Research Center, Germany since the beginning of 1980. Its advantages are: it could make three-dimensional microstructures with lateral dimension in several micron range and thickness of several hundred microns with sub-micron precision. In principle all kinds of materials such as polymer, metal and ceramic could be used as microcomponents and could be mass- produced by plastic molding to a commercially available fabrication. LIGA process has become one of the most promising Microfabrication technologies for producing micromechanical, microfluid and micro-optical elements. It opens an additional field in the microstructure market.

Paper Details

Date Published: 15 August 1998
PDF: 5 pages
Proc. SPIE 3550, Laser Processing of Materials and Industrial Applications II, (15 August 1998); doi: 10.1117/12.317962
Show Author Affiliations
Esheng Tang, Institute of High Energy Physics (China)
Yi FuTing, Institute of High Energy Physics (China)
Yangchao Tian, Univ. of Science and Technology of China (China)
Jingqiu Liang, Changchun Institute of Optics and Fine Mechanics (China)
Dingchang Xian, Institute of High Energy Physics (China)

Published in SPIE Proceedings Vol. 3550:
Laser Processing of Materials and Industrial Applications II
ShuShen Deng; S. C. Wang, Editor(s)

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