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Proceedings Paper

Laser drilling for improving circuit board manufacturing
Author(s): Gang Yu; Jincheng Zhang; Chunlin Gao; Honcai Wang; Ping Li; Yongqiang An; Guiqiu Zhang
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Paper Abstract

We reported here a novel technique for laser high speed drillings on Printed Circuit Boards (PCBs). A CNC solid laser based system is developed to drill through and blind vias as an alternative to mechanical drilling. The system employs an Acousto-Optic Q-switched Nd:YAG laser, a computer control system and an X-Y moving table which can handle up to 400 X 400 mm PCB. With a special designed cavity the laser system works in a pulsed operation in order to generate pulses with width down to 0.5 microseconds and maximum peak power over 10 kW at 10 k repetition rate. Delivered by an improved optical beam transforming system, the focused laser beam can drill holes including blind vias on PCBs with diameter in the range of 0.1 - 0.4 mm and at up to 300 - 500 vias per second (depending on the construction of PCBs). By means of a CNC X-Y moving system, laser pulses with pulse-to-pulse superior repeatability can be fired at desired location on a PCBs with high accuracy. This alternative technology for drilling through or blind vias on PCBs or PWBs (printed wiring boards) will obviously enhance the capability to printed boards manufacturing.

Paper Details

Date Published: 15 August 1998
PDF: 6 pages
Proc. SPIE 3550, Laser Processing of Materials and Industrial Applications II, (15 August 1998); doi: 10.1117/12.317889
Show Author Affiliations
Gang Yu, Institute of Mechanics (China)
Jincheng Zhang, Institute of Mechanics (China)
Chunlin Gao, Institute of Mechanics (China)
Honcai Wang, Institute of Mechanics (China)
Ping Li, Institute of Mechanics (China)
Yongqiang An, Institute of Mechanics (China)
Guiqiu Zhang, Institute of Mechanics (China)


Published in SPIE Proceedings Vol. 3550:
Laser Processing of Materials and Industrial Applications II
ShuShen Deng; S. C. Wang, Editor(s)

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