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Proceedings Paper

Employing an out-of-plane coupling model for optical sub-assembly packaging applications
Author(s): W. T. Chen; Lon A. Wang
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Paper Abstract

An appropriate analytical model which deals with out-of- plane coupling between an elliptical Gaussian beam and an angled single mode fiber is developed and utilized for two potential applications. The first one is for fast search of the optimal coupling efficiency in an optical sub-assembly packaging process while the second one is for the inspection of concentricity between the up and low tooling in an optical sub-assembly packaging system.

Paper Details

Date Published: 19 June 1998
PDF: 5 pages
Proc. SPIE 3420, Optical Fiber Communication, (19 June 1998); doi: 10.1117/12.312866
Show Author Affiliations
W. T. Chen, National Taiwan Univ. (Taiwan)
Lon A. Wang, National Taiwan Univ. (Taiwan)

Published in SPIE Proceedings Vol. 3420:
Optical Fiber Communication
Winston I. Way; Franklin F. Tong; Alan Eli Willner, Editor(s)

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