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Proceedings Paper

Negative pattern fabrication using laser exposure of positive photoresist
Author(s): Boris Kobrin; Colleen Hagen
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Paper Abstract

The method of simultaneous positive and negative pattern formation on a single positive photoresist layer is described. A negative photoresist pattern was fabricated by using local laser exposure to crosslink a positive resist layer, consecutive UV flood exposure, and resist developing. The positive pattern is obtained on the same photoresist layer in the areas masked from the UV flood exposure. Effects of laser energy and resist processing parameters on height and width of negative type resist structures were investigated. Metal line grid structures with lines in the region of 3 to 30 micrometers in width were manufactured on a 5' X 5' glass substrate using this technique. The proposed method of positive/negative pattern formation significantly reduces the number of technological steps in the fabrication of diffractive elements for dual-wavelength applications.

Paper Details

Date Published: 29 June 1998
PDF: 10 pages
Proc. SPIE 3333, Advances in Resist Technology and Processing XV, (29 June 1998); doi: 10.1117/12.312380
Show Author Affiliations
Boris Kobrin, Rochester Photonics Corp. (United States)
Colleen Hagen, Rochester Photonics Corp. (United States)

Published in SPIE Proceedings Vol. 3333:
Advances in Resist Technology and Processing XV
Will Conley, Editor(s)

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