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Proceedings Paper

Review of laser micromachining in contract manufacturing
Author(s): Glenn Ogura; Bo Gu
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Paper Abstract

This paper explores the wide range of laser micromachining applications used in contract manufacturing. Contract manufacturing is used in several key industries such as microelectronics packaging, semiconductor, data storage, medical devices, communications, peripherals, automobiles and aerospace. Material types includes plastics, metals, ceramics, inorganics and composites. However laser micromachining is just one available technology for micromachining and other methods will be reviewed. Contract manufacturing offers two important glimpses of the future. Firstly prototype work for new applications often beings in contract manufacturing. Secondly, contract manufacturing can be an economic springboard to allow laser systems to be installed in a production environment.

Paper Details

Date Published: 3 June 1998
PDF: 12 pages
Proc. SPIE 3274, Laser Applications in Microelectronic and Optoelectronic Manufacturing III, (3 June 1998); doi: 10.1117/12.309508
Show Author Affiliations
Glenn Ogura, Resonetics, Inc. (United States)
Bo Gu, Lumonics Inc. (United States)

Published in SPIE Proceedings Vol. 3274:
Laser Applications in Microelectronic and Optoelectronic Manufacturing III
Jan J. Dubowski; Peter E. Dyer, Editor(s)

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