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Proceedings Paper

Smart-pixel module development for free-space optical interconnects
Author(s): Yue Liu
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Paper Abstract

Over the years, the distances at which optical interconnect technology is considered competitive with copper has been steadily decreasing. For instance, initial implementation of fiber optic communication was in long distance telecommunications. Eventually fiber optic links began to appear in local area network backbones over distance scales from 100 meters to 2km. Most recently, there has been an acceptance that fiber optic interconnects are competitive inside servers or switches, at distances on the order of 10 meters. Therefore one might ask at what level optical interconnects will be applied in the future. Will they be cost effective inside a box (1 meter?). Could they even provide an interconnect function between chips on a board or MCM (1-10 cm)? As interconnect distances become progressively shorter, the cost limitations become more and more severe.

Paper Details

Date Published: 22 May 1998
PDF: 4 pages
Proc. SPIE 3490, Optics in Computing '98, (22 May 1998); doi: 10.1117/12.308869
Show Author Affiliations
Yue Liu, Honeywell Technology Ctr. (United States)

Published in SPIE Proceedings Vol. 3490:
Optics in Computing '98
Pierre H. Chavel; David A. B. Miller; Hugo Thienpont, Editor(s)

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