Proceedings Paper
Optomechanical, electrical, and thermal packaging of large 2D optoelectronic device arrays for free-space optical interconnects| Format | Member Price | Non-Member Price |
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Paper Details
Date Published: 22 May 1998
PDF: 4 pages
Proc. SPIE 3490, Optics in Computing '98, (22 May 1998); doi: 10.1117/12.308862
Published in SPIE Proceedings Vol. 3490:
Optics in Computing '98
Pierre H. Chavel; David A. B. Miller; Hugo Thienpont, Editor(s)
PDF: 4 pages
Proc. SPIE 3490, Optics in Computing '98, (22 May 1998); doi: 10.1117/12.308862
Show Author Affiliations
Michael H. Ayliffe, McGill Univ. (Canada)
D. Kabal, McGill Univ. (Canada)
P. Khurana, McGill Univ. (Canada)
Frederic K. Lacroix, McGill Univ. (Canada)
D. Kabal, McGill Univ. (Canada)
P. Khurana, McGill Univ. (Canada)
Frederic K. Lacroix, McGill Univ. (Canada)
Andrew G. Kirk, McGill Univ. (Canada)
Frank A. P. Tooley, McGill Univ. (Canada)
David V. Plant, McGill Univ. (Canada)
Frank A. P. Tooley, McGill Univ. (Canada)
David V. Plant, McGill Univ. (Canada)
Published in SPIE Proceedings Vol. 3490:
Optics in Computing '98
Pierre H. Chavel; David A. B. Miller; Hugo Thienpont, Editor(s)
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