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Proceedings Paper

Fast-etch antireflective coating for sub-0.35-um i-line microlithography applications
Author(s): Paul Williams; Xie Shao; James E. Lamb III; Colin Hester; Tony D. Flaim
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Paper Abstract

We report here the development of a fast-etching i-line bottom anti-reflective coating (BARC): EXP97002B. The new BARC is applied from a safe solvent system, exhibits wide spin bowl compatibility with photoresists, and may be processed with common edge bead removal solvents. The optical density of the new BARC is 6.15/micrometer at 365 nm (n equals 1.71, k equals 0.39). We have demonstrated plasma etch rates for the new coating in excess of 1.5 - 2.0 times that of conventional i- line photoresists. The coating system planarizes substrate topography, reducing resist film thickness variations and, thereby, resist swing. Feature coverage is still excellent, as evidenced by the ability of the new BARC to coat 0.7 micrometer vertical topography. The practical issues for implementing the new BARC in a manufacturing environment is also discussed.

Paper Details

Date Published: 8 June 1998
PDF: 8 pages
Proc. SPIE 3332, Metrology, Inspection, and Process Control for Microlithography XII, (8 June 1998); doi: 10.1117/12.308762
Show Author Affiliations
Paul Williams, Brewer Science Ltd. (United States)
Xie Shao, Brewer Science Inc. (United States)
James E. Lamb III, Brewer Science Inc. (United States)
Colin Hester, Brewer Science Inc. (United States)
Tony D. Flaim, Brewer Science Inc. (United States)

Published in SPIE Proceedings Vol. 3332:
Metrology, Inspection, and Process Control for Microlithography XII
Bhanwar Singh, Editor(s)

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