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Proceedings Paper

SPC tracking and run monitoring of a CD SEM
Author(s): John A. Allgair; Dustin G. Ruehle; Richard C. Elliott; Pedro P. Herrera; John D. Miller
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Paper Abstract

Semiconductor manufacturers should ensure that their automated critical dimension scanning electron microscopes (CD-SEMs) are maintaining run functionality in addition to providing precise and reliable measurements over time. In the past, chip manufactures have focused more on tracking measurement repeatability because testing for automated run functionality has proven difficult. A new method employing SPC monitoring, e-beam image analysis, line scan tracking, and automation testing has been developed that tests for both measurement and job repeatability. This method will extend the monitor wafer's lifetime, prove useful for day-to-day system qualification, provide a benchmark for SEM qualification following maintenance work, and become an important cornerstone of system matching.

Paper Details

Date Published: 8 June 1998
PDF: 9 pages
Proc. SPIE 3332, Metrology, Inspection, and Process Control for Microlithography XII, (8 June 1998); doi: 10.1117/12.308732
Show Author Affiliations
John A. Allgair, Motorola (United States)
Dustin G. Ruehle, Motorola (United States)
Richard C. Elliott, KLA-Tencor Corp. (United States)
Pedro P. Herrera, KLA-Tencor Corp. (United States)
John D. Miller, KLA-Tencor Corp. (United States)

Published in SPIE Proceedings Vol. 3332:
Metrology, Inspection, and Process Control for Microlithography XII
Bhanwar Singh, Editor(s)

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