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Proceedings Paper

Micromachining for silicon microaccelerometer
Author(s): Kunchinadka Narayana Hari Bhat
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Paper Abstract

In this paper, the concepts of `bulk' and `surface' micromachining are first presented. The fabrication techniques for realizing silicon microaccelerometer using these two approaches are next presented. In both the cases, the acceleration is measured by detecting the change in the capacitance due to the deflection of an inertial mass called seismic mass or proof mass with respect to fixed plates. The relative merits of the two approaches are presented to allow that in spite of the simplicity and low cost nature of bulk micromachining, the surface micromachining has gained popularity because of its versatility and suitability for integrating the surface micromachined sensors with the integrated circuits.

Paper Details

Date Published: 16 April 1998
PDF: 12 pages
Proc. SPIE 3321, 1996 Symposium on Smart Materials, Structures, and MEMS, (16 April 1998); doi: 10.1117/12.305558
Show Author Affiliations
Kunchinadka Narayana Hari Bhat, Indian Institute of Technology (India)

Published in SPIE Proceedings Vol. 3321:
1996 Symposium on Smart Materials, Structures, and MEMS
Vasu K. Aatre; Vijay K. Varadan; Vasundara V. Varadan, Editor(s)

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