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Proceedings Paper

Surface-wave-based sensor for evaluating in-situ consolidation of polymer composites
Author(s): Susan C. Mantell; D. Holley; Elizabeth J. Linstrom
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Paper Abstract

A sensor for detecting poor interlaminar bonding between a topmost ply and composite substrate was developed and validated. The sensor was designed for the specific application of real time process control for in situ consolidation processes, in which the composite structure is local heat and pressure are applied by a moving head as each new composite tow is laid down upon the existing composite substrate. The sensor is designed to follow the consolidation head and provide real time information on the quality of bonding between the topmost play and substrate. The sensor design consists of two piezoelectric transducers oriented in a pitch catch arrangement. The transmitting transducer is angled so as to produce surface waves in the composite panel. These waves interact with defects at the top ply/substrate interface. The received signal is analyzed for wave speed, attenuation and energy dissipation. Experimental validation of he sensor is presented for thermosetting matrix composites. Several composite panels were made under various manufacturing conditions so as to create poor interlaminar bonding at the topmost ply. Interlaminar bonding was then evaluated by destructive and nondestructive measures. There was good agreement between the destructive and nondestructive measures of top ply bond strength.

Paper Details

Date Published: 15 March 1998
PDF: 12 pages
Proc. SPIE 3399, Process Control and Sensors for Manufacturing, (15 March 1998); doi: 10.1117/12.302539
Show Author Affiliations
Susan C. Mantell, Univ. of Minnesota/Twin Cities (United States)
D. Holley, Univ. of Minnesota/Twin Cities (United States)
Elizabeth J. Linstrom, Univ. of Minnesota/Twin Cities (United States)

Published in SPIE Proceedings Vol. 3399:
Process Control and Sensors for Manufacturing
Richard H. Bossi; David M. Pepper, Editor(s)

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