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Proceedings Paper

Application of solvent bonding technique to achieve a highly reliable low-cost CATV PIN package
Author(s): Ching Long Jiang; Steve O'Neill; Hai Sheng Wang
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Paper Abstract

In order to lower the cost of optoelectronic packaging, a novel solvent bonding technique has been developed to bond two thermoplastic surfaces, permanently, with a room- temperature cure of approximately 30 seconds. This technique has been applied to a pigtailed PIN module with a canted fiber. As model has been developed as a design tool to simulate the responsivity and the optical back reflection of various configurations of different angled fibers and canted angles with respect to the PIN detector. Close agreement between simulations and measurements of responsivity and optical back reflection has been achieved. With this design tool, a low cost pigtailed PIN module utilizing a novel solvent bonding technique has been developed to meet CATV applications.

Paper Details

Date Published: 1 February 1998
PDF: 8 pages
Proc. SPIE 3234, Design and Manufacturing of WDM Devices, (1 February 1998); doi: 10.1117/12.300924
Show Author Affiliations
Ching Long Jiang, AMP Inc. (United States)
Steve O'Neill, AMP Inc. (United States)
Hai Sheng Wang, AMP Inc. (United States)

Published in SPIE Proceedings Vol. 3234:
Design and Manufacturing of WDM Devices
Ray T. Chen; Louis S. Lome, Editor(s)

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