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Proceedings Paper

Statistical analysis on the measuring resolution of edge position by digital imaging
Author(s): Seung-Woo Kim; SangYoon Lee; Jeong Kwan Lee
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Paper Abstract

The semiconductor industry relies on digital optical imaging for the overlay metrology of integrated circuit patterns. One critical performance demand in the particular application of digital imaging is placed on the edge resolution that is defined as the smallest detectable variation of the edge image profile acquired in digital form. As the critical feature size of integrated circuit patterns reaches below 0.35 micrometers, the edge resolution is required to be less than 0.01 micrometers. This requirement is so stringent that fundamental behaviors of digital optical imaging need to be further explored especially for precision coordinate metrology. Our investigation reveals that the edge resolution shows quasi- random characteristics, not being simply deduced from relevant opto-electronic system parameters. Hence, a stochastic upper bound analysis is made to come up with the worst edge resolution that can statistically well predict actual indeterminate edge resolutions obtained with high magnification microscope objectives.

Paper Details

Date Published: 12 December 1997
PDF: 11 pages
Proc. SPIE 3173, Ultrahigh- and High-Speed Photography and Image-based Motion Measurement, (12 December 1997); doi: 10.1117/12.294524
Show Author Affiliations
Seung-Woo Kim, Korea Advanced Institute of Science and Technology (South Korea)
SangYoon Lee, Korea Advanced Institute of Science and Technology (South Korea)
Jeong Kwan Lee, Samsung Electronics (South Korea)

Published in SPIE Proceedings Vol. 3173:
Ultrahigh- and High-Speed Photography and Image-based Motion Measurement
C. Bruce Johnson; Andrew Davidhazy; James S. Walton; Takeharu Goji Etoh; C. Bruce Johnson; Donald R. Snyder; James S. Walton, Editor(s)

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