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Proceedings Paper

Characterization of environmental halogen molecule contamination-induced pad surface corrosion
Author(s): Po-Tao Chu; Ching-Wen Cho; Hung-Chi Hsiao; Jie-Shin Wu; Chih-Chien Hung; Ying-Chen Chao
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Paper Abstract

The photoresist stripping process in passivation stage could induce the bonding pad surface corrosion (Figure-i). And the bonding pad surface corrosion rates will be accelerated if the chlorine concentration levels reach 5 to i 0 ppb in the cleanroom environment. The facility hookup of the exhaust pipelines and the cross contamination between the different airflow system has been identified to be critical regarding the chlorine concentration levels. In order to improve the pad surface susceptibility toward the chlorine molecules induced pad surface corrosion, the CF4 treatment is proposed with excellent passivation and replacement effects.

Paper Details

Date Published: 11 September 1997
PDF: 8 pages
Proc. SPIE 3216, Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III, (11 September 1997); doi: 10.1117/12.284704
Show Author Affiliations
Po-Tao Chu, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Ching-Wen Cho, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Hung-Chi Hsiao, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Jie-Shin Wu, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Chih-Chien Hung, Taiwan Semiconductor Manufacturing Co. (Taiwan)
Ying-Chen Chao, Taiwan Semiconductor Manufacturing Co. (Taiwan)

Published in SPIE Proceedings Vol. 3216:
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III
Ali Keshavarzi; Sharad Prasad; Hans-Dieter Hartmann, Editor(s)

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