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Proceedings Paper

Molecular and ionic contamination monitoring for cleanroom air and wafer surfaces
Author(s): Peng Sun; Marty Adams; Larry Shive; Saeed Pirooz
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Paper Abstract

Advances in the electronic industry toward large-scale integration of semiconductor devices have placed strict demands on the ability to measure and monitor ultratrace levels of impurities. Even though they have been found to have increasingly detrimental impacts on the performance and yield of semiconductor products, organic and non-metal ionic contaminants have not received the same attention as particles and metallics. Method developments for ultratrace measurements of molecular and ionic contamination are far behind the demands. This paper describes the use of different sampling and analytical techniques to assess and monitor molecular and ionic contaminants in cleanroom ambient air and on wafer surfaces. Thermal desorption gas chromatography mass spectrometry/nitrogen phosphorous detector is used for the identification and quantification of organic contaminants. Ammonium (NH4+) and inorganic anions are analyzed by using capillary electrophoresis with indirect UV detection methods. The identification and quantification of specific organic compounds, which outgas from cleanroom ULPA filters and wafer package boxes and tend to adsorb on silicon wafers, will be demonstrated. Ammonium and anion contamination for different wafer cleaning processes will be compared. The capabilities, applications, and limitations of these techniques will be discussed in further details.

Paper Details

Date Published: 2 September 1997
PDF: 10 pages
Proc. SPIE 3215, In-Line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing, (2 September 1997);
Show Author Affiliations
Peng Sun, MEMC Electronic Materials, Inc. (United States)
Marty Adams, MEMC Electronic Materials, Inc. (United States)
Larry Shive, MEMC Electronic Materials, Inc. (United States)
Saeed Pirooz, MEMC Electronic Materials, Inc. (United States)

Published in SPIE Proceedings Vol. 3215:
In-Line Characterization Techniques for Performance and Yield Enhancement in Microelectronic Manufacturing
Damon K. DeBusk; Sergio A. Ajuria, Editor(s)

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