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Proceedings Paper

Design and development of microstructures for MEMS applications
Author(s): Sudhir Chandra; Janak Singh; Ami Chand
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Paper Abstract

A new approach has been proposed to realize suspended microstructures such as cantilevers, diaphragms, springs, spirals, etc. over pits of controlled depth in bulk silicon micromachining process using direct wafer bonding technology. The structures have been realized in heavily boron doped silicon and dielectric layers. The electrostatic actuation voltage of the cantilever beams have been computed as a function of physical parameters and compared with experimentally measured values. LPCVD polysilicon has been investigated with a view to obtain low stress films for use in surface micromachining technology. The effect of deposition parameters on stress in the polysilicon films has been studied. Post deposition annealing is shown to have profound effect on the stress properties of the polysilicon films. Rapid thermal annealing is found to be much more effective in reducing the stress compared to conventional furnace annealing. The advantage of direct wafer bonding technology for electrostatically actuated microstructures have been presented. The application of this technology for MEMS have been discussed.

Paper Details

Date Published: 2 September 1997
PDF: 9 pages
Proc. SPIE 3226, Microelectronic Structures and MEMS for Optical Processing III, (2 September 1997); doi: 10.1117/12.284571
Show Author Affiliations
Sudhir Chandra, Indian Institute of Technology (India)
Janak Singh, Indian Institute of Technology (India)
Ami Chand, Indian Institute of Technology (India)

Published in SPIE Proceedings Vol. 3226:
Microelectronic Structures and MEMS for Optical Processing III
M. Edward Motamedi; Hans Peter Herzig, Editor(s)

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