Share Email Print

Proceedings Paper

Microsystem packaging in 3D
Author(s): Gerard Kelly; John C. Alderman; C. Lyden; James Barrett; Anthony Morrissey
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Packaging influences the reliability and performance of microsystems. A brief history of developments in packaging is presented along with an overview of 3D packaging philosophy. An example of the integration of a micromachined silicon membrane pump into a 3D vertical multichip module package is presented. Finite element techniques are used to analyze the encapsulation stress in the assembled structure to improve the integrity of the packaged microsystem.

Paper Details

Date Published: 5 September 1997
PDF: 11 pages
Proc. SPIE 3224, Micromachined Devices and Components III, (5 September 1997); doi: 10.1117/12.284509
Show Author Affiliations
Gerard Kelly, University College/Cork (Ireland)
John C. Alderman, University College/Cork (Ireland)
C. Lyden, University College/Cork (Ireland)
James Barrett, University College/Cork (Ireland)
Anthony Morrissey, University College/Cork (Ireland)

Published in SPIE Proceedings Vol. 3224:
Micromachined Devices and Components III
Kevin H. Chau; Patrick J. French, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?