Share Email Print

Proceedings Paper

Advanced micromechanisms in a multilevel polysilicon technology
Author(s): M. Steven Rodgers; Jeffry J. Sniegowski; Samuel L. Miller; Carole Craig Barron; Paul J. McWhorter
Format Member Price Non-Member Price
PDF $17.00 $21.00

Paper Abstract

Quad-level polysilicon surface micromachining technology, comprising three mechanical levels plus an electrical interconnect layer, is giving rise to a new generation of micro-electromechanical devices and assemblies. Enhanced components can now be produced through greater flexibility in fabrication and design. New levels of design complexity that include multi-level gears, single-attempt locks, and optical elements have recently been realized. Extensive utilization of the fourth layer of polysilicon differentiates these latter generation devices from their predecessors. This level of poly enables the fabrication of pin joints, linkage arms, hinges on moveable plates, and multi-level gear assemblies. The mechanical design aspects of these latest micromachines will be discussed with particular emphasis on a number of design modifications that improve the power, reliability, and smoothness of operation of the microengine. The microengine is the primary actuation mechanism that is being used to drive mirrors out of plane and rotate 1600-micrometers diameter gears. Also discussed is our most advanced micromechanical system to date, a complex proof-of-concept batch-fabricated assembly that, upon transmitting the proper electrical code to a mechanical lock, permits the operation of a micro-optical shutter.

Paper Details

Date Published: 5 September 1997
PDF: 11 pages
Proc. SPIE 3224, Micromachined Devices and Components III, (5 September 1997); doi: 10.1117/12.284507
Show Author Affiliations
M. Steven Rodgers, Sandia National Labs. (United States)
Jeffry J. Sniegowski, Sandia National Labs. (United States)
Samuel L. Miller, Sandia National Labs. (United States)
Carole Craig Barron, Sandia National Labs. (United States)
Paul J. McWhorter, Sandia National Labs. (United States)

Published in SPIE Proceedings Vol. 3224:
Micromachined Devices and Components III
Kevin H. Chau; Patrick J. French, Editor(s)

© SPIE. Terms of Use
Back to Top
Sign in to read the full article
Create a free SPIE account to get access to
premium articles and original research
Forgot your username?