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Proceedings Paper

Automated inspection in printed circuit board assembly (PCBA) manufacturing
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Paper Abstract

Visual inspection has long been a necessary method of quality control in Printed Circuit Board Assemblies (PCBA) manufacturing. The characteristics of electronic assemblies have changed substantially over the last decade. Todays high lead count, fine pitch SMT components are becoming even more difficult for humans to inspect at the same time automated inspection systems have become reliable than manual inspection and are now accepted as valuable tools for producing high quality PCBA products. The basic requirements of an automated inspection system remain same in all PCBA manufacturing but the type of the automated system (off- line/on-line), where applied in the production flow, entire boards or only on a sample basis, inspection coverage (100% or partial) vary between different PCBA manufacturers. In PCBA manufacturing the emphasis is more in the electrical functionality of the PCBA than in it's appearance. It is nearly impossible to impose stringent specifications in the appearance of the components and other materials used in PCBA manufacturing. Due to the large number of component/PCB supplier and wide variations in materials and processes the challenge in successfully automating the inspection process is the variability in the appearance of components on PCBA. But in a high volume PCBA manufacturing where fewer board types are running in large volumes for long periods of time, the variability in component appearance can be controlled much better than a low volume PCBA manufacturing where more types are running in low volumes for short period of time. This paper discusses the development and implementation of a low cost flexible automated inspection system for PCBAs. The system can detect over ninety percent of visual defects on PCBAs. The key features of the system are quick and easy set-up, capability to inspect different types of board and quick change over between different boards and low cost.

Paper Details

Date Published: 18 August 1997
PDF: 11 pages
Proc. SPIE 3185, Automatic Inspection and Novel Instrumentation, (18 August 1997); doi: 10.1117/12.284039
Show Author Affiliations
Francy Kunnel Abraham, Gintic Institute of Manufacturing Technology (Singapore)

Published in SPIE Proceedings Vol. 3185:
Automatic Inspection and Novel Instrumentation
Anthony Tung Shuen Ho; Sreenivas Rao; Lee Ming Cheng, Editor(s)

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