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Proceedings Paper

Direct writing of nano patterns with nearfield enhanced laser radiation
Author(s): Johann Jersch; Frank Demming; L. J. Hildenhagen; Klaus Dickmann
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Paper Abstract

Nano processing is a cornerstone technology for several future oriented applications, as for example in the fields of high density data storage, nano matching of X-ray fresnel optics, micro electronics, micro robotics and biomolecularic. However, as well known, processing in the nanometer range with laser radiation is not possible by lenses or mirrors due to diffraction limitation. Recent research work has shown, that `focusing' of laser radiation down to a few nanometer can be obtained by using lasers in combination with nearfield technology (e.g. SNOM--Scanning Nearfield Optical Microscopy, SPM--Scanning Probe Microscopy). Lateral externally illumination of SPM probe tips with laser radiation can cause tremendous intensity enhancement in the nearfield underneath the tip. A brief theoretical consideration of this effect and results of calculations based on boundary element method is done. This kind of field energy concentration we named FOLANT-technique (FOcusing of LAserradiation in the Nearfield of a Tip). The interaction area with nanometer scale can be applied for material processing even down to atomic dimensions. Using FOLANT-technique hillocks, pits and grooves with lateral dimensions down to 10 nm have been obtained on conductive substrates as well as on dielectric materials (for example polycarbonate). Our experiments have shown, that FOLANT- technique is a promising tool for various applications in nanometer material processing.

Paper Details

Date Published: 18 August 1997
PDF: 8 pages
Proc. SPIE 3097, Lasers in Material Processing, (18 August 1997);
Show Author Affiliations
Johann Jersch, Fachhochschule Muenster (Germany)
Frank Demming, Fachhochschule Muenster (Germany)
L. J. Hildenhagen, Fachhochschule Muenster (Germany)
Klaus Dickmann, Fachhochschule Muenster (Germany)

Published in SPIE Proceedings Vol. 3097:
Lasers in Material Processing
Leo H. J. F. Beckmann, Editor(s)

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