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Proceedings Paper

Excimer laser patterning of thick and thin films for high-density packaging
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Paper Abstract

Excimer laser projection methods have ben developed to directly create high resolution electrical circuits in both thin nd thick-film metallic layers in order to form robust, compact multi-chip module interconnection devices, miniature sensor elements, miniature flexible printed circuits, antennas etc at high sped and low cost. Patterning over small or large areas is possible at high speed using simple step and repeat or more complex synchronous mask and workpiece scanning methods. Ablation rates depend strongly upon the thickness of the metal layer varying from complete metal removal with 1 laser shot for thin films to multiple 10s of shots for films to a few J/cm2 for screen printed polymer thick films or thick sputtered films. Multiple layer interconnect circuits and complex advanced sensor devices have been successfully fabricated using these excimer laser metal film patterning methods together with laser via drilling and patterning of dielectric layers using a laser tool with appropriate level to level alignment and mask changing and scanning facilities.

Paper Details

Date Published: 18 August 1997
PDF: 10 pages
Proc. SPIE 3184, Microelectronic Packaging and Laser Processing, (18 August 1997); doi: 10.1117/12.280571
Show Author Affiliations
Phil T. Rumsby, Exitech Ltd. (United Kingdom)
Erol C. Harvey, Exitech Ltd. (United Kingdom)
Dafydd T. Thomas, Exitech Ltd. (United Kingdom)
Nadeem Hasan Rizvi, Exitech Ltd. (United Kingdom)

Published in SPIE Proceedings Vol. 3184:
Microelectronic Packaging and Laser Processing
Yong Khim Swee; HongYu Zheng; Ray T. Chen, Editor(s)

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